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Mumbai, India | November 7, 2026: Paras Semiconductors, a subsidiary of Paras Defence & Space TechnologiesLimited, announced a strategic technology partnership with BroadPak Corporation, USA, to accelerate the development of advanced semiconductor packaging capabilities in India. The collaboration will combine Paras's manufacturing ambitions in Opto-electronics,photonics and copackaged optics high with BroadPak's specialised technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures.
Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT (Outsourced Semiconductor Assembly and Test) facilityin India. The proposed facility will focus on developing capabilities across 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics and advanced semiconductor testing and qualification.
BroadPak Corporation, headquartered in San Jose, California, brings specialised expertise across advanced packaging design, manufacturing and system integration. Founded in2007, the company has worked across 2.5D/3D IC packaging, heterogeneous integration, multi-die architectures, highspeed interconnects, thermal management and co-packaged optics. Its capabilities span the packaging development cycle, from architecture and designto simulation, assembly, testing and production.
Under the collaboration, Paras Semiconductors will gain access to BroadPak's advanced design, manufacturing and integration intellectual property, alongside technology transferand process knowhow in 2.5D/3D packaging and chiplet integration. The partnership will also explore the joint development of advanced packaging platforms for AI and high-performance computing applications, as well as collaborative training and skill developmentfor Indian engineers.
The proposed facility will address the need for high volume manufacturing and strategic electronics, particularly semiconductor devices for optical and optronic systems, alongsidehigh-performance computing (HPC), networking and data centre applications. Its planned capabilities will cover waferlevel processing, hybrid bonding, through-silicon vias (TSVs), micro-bumping, advanced interposers, redistribution layer (RDL) technologies,co-packaged optics and high-end testing and reliability qualification.
Commenting on the partnership, Munjal Sharad Shah, Managing Director, Paras Defence & Space Technologies Limited, said, "Our entry into the semiconductor sector representsa strategic expansion into a technology domain that is increasingly critical to India’s AI and data centres and industrial capabilities. With Paras Semiconductors, we are looking to build capabilities in advanced packaging that complement our existing strengthsin optics, optronics and critical electronics. Our collaboration with BroadPak brings the specialised technology expertise required to accelerate this ambition and develop capabilities that can serve both strategic domestic requirements and the wider semiconductorindustry."
Santosh Kumar, Chief Executive Officer, Paras Semiconductors, said, "The semiconductor industry's requirementsare evolving beyond conventional chip manufacturing towards advanced integration of multiple dies, memory and processing components within a single package. Our collaboration with BroadPak will help us develop capabilities across 2.5D/3D heterogeneous integration,chiplet architectures, hybrid bonding and advanced system-in-package technologies. We intend to build an advanced packaging platform that can address the increasingly complex performance, connectivity and thermal requirements of next-generation semiconductorapplications."
